Influence of Surfactants on Copper-CNTs Electrodeposition

dc.citation.epage131
dc.citation.issue1
dc.citation.spage125
dc.contributor.affiliationNational Metallurgical Academy of Ukraine
dc.contributor.affiliationPaton Electric Welding Institute of NAS of Ukraine
dc.contributor.authorRoslyk, Iryna
dc.contributor.authorStovpchenko, Ganna
dc.contributor.authorGalchenko, Galyna
dc.coverage.placenameЛьвів
dc.coverage.placenameLviv
dc.date.accessioned2024-01-09T09:32:57Z
dc.date.available2024-01-09T09:32:57Z
dc.date.created2021-03-16
dc.date.issued2021-03-16
dc.description.abstractВ роботі експериментально визначено вплив поверхнево-активних речовин (ПАР) різного типу на процеси сумісного електрохімічного осадження композиційного порошку мідь-вуглець (графіт, вуглецеві нанотрубки (ВНТ)). Показано, що введення ПАР CTAB зменшує розмір частинок порошку та покращує їх корозійну стійкість. Максимальний ефект одержано при введенні до електроліту ПАР катіонної дії - CTAB з одночасним обробленням ультразвуком для диспергування ВНТ.
dc.description.abstractInfluence of different types of surfactants on electrodeposition of copper- and carbon-bearing (graphite, carbon nanotubes (CNTs)) composite powder has been experimentally investigated. The size of powder particles decreased, and corrosion resistance increased when surfactants were added. Addition of cationic surfactant CTAB to the electrolyte with simultaneous ultrasonic treatment for CNTs dispersion gives maximum effect.
dc.format.extent125-131
dc.format.pages7
dc.identifier.citationRoslyk I. Influence of Surfactants on Copper-CNTs Electrodeposition / Iryna Roslyk, Ganna Stovpchenko, Galyna Galchenko // Chemistry & Chemical Technology. — Lviv : Lviv Politechnic Publishing House, 2021. — Vol 15. — No 1. — P. 125–131.
dc.identifier.citationenRoslyk I. Influence of Surfactants on Copper-CNTs Electrodeposition / Iryna Roslyk, Ganna Stovpchenko, Galyna Galchenko // Chemistry & Chemical Technology. — Lviv : Lviv Politechnic Publishing House, 2021. — Vol 15. — No 1. — P. 125–131.
dc.identifier.doidoi.org/10.23939/chcht15.01.125
dc.identifier.urihttps://ena.lpnu.ua/handle/ntb/60694
dc.language.isoen
dc.publisherВидавництво Львівської політехніки
dc.publisherLviv Politechnic Publishing House
dc.relation.ispartofChemistry & Chemical Technology, 1 (15), 2021
dc.relation.references[1] Pavlenko V., Yas D.:J. Powder Metall. Met. Ceram., 1976, 15, 89. https://doi.org/10.1007/BF00793555
dc.relation.references[2] Uk P-H., Chung T-J., Lee H.:J. Ceram. Process. Res., 2017, 18, 440.
dc.relation.references[3] Chu Y., Yu G., Hu B. et al.: Adv. Powder Technol., 2014, 25, 477. https://doi.org/10.1016/j.apt.2013.07.003
dc.relation.references[4] Chen L., Yu G., Chu Y. et al.: Adv. Powder Technol., 2013, 24, 281. https://doi.org/10.1016/j.apt.2012.07.003
dc.relation.references[5] Ajayan P., Schadler L., Braun P. (Eds.): Nanocomposite Science and Technology. Wiley-VCH Verlag GmbH, Weinheim 2003. https://doi.org/10.1002/3527602127
dc.relation.references[6] Toth G., Maklin J., Halonen N. et al.: Adv. Mater., 2009, 21, 2054. https://doi.org/10.1002/adma.200802200
dc.relation.references[7] Berber S., Kwon Y., Tomanek D.: Phys. Rev. Lett., 2000, 84, 4613. https://doi.org/10.1103/PhysRevLett.84.4613
dc.relation.references[8]Jayathilaka W., Chinnappan A., Ramakrishna S.:J. Mater. Chem., 2017, C5, 9209. https://doi.org/10.1039/C7TC02965A
dc.relation.references[9]Jiang L., Gao L., Sun J.:J. Colloid Interf. Sci., 2003, 260, 89. https://doi.org/10.1016/S0021-9797(02)00176-5
dc.relation.references[10] Moore V., Strano M., Haroz E. et al.: Nano Leters, 2003, 3, 1379. https://doi.org/10.1021/nl034524j
dc.relation.references[11] Rastogi R., Kaushal R., Tripathi S. et al.:J. Colloid Interf. Sci., 2008, 328, 421. https://doi.org/10.1016/j.jcis.2008.09.015
dc.relation.references[12] Strano M., Moore V., Miller M. et al.:J. Nanosci. Nanotechnol., 2003, 3, 81. https://doi.org/10.1166/jnn.2003.194
dc.relation.references[13] Vaisman L., Wagner H., Marom G.: Adv. Colloid Interf. Sci., 2006, 128-130, 37. https://doi.org/10.1016/j.cis.2006.11.007
dc.relation.references[14] Schneider M., Weiser M., Dorfler S. et al.: Surg. Eng., 2012, 28, 34. https://doi.org/10.1179/1743294411Y.0000000095
dc.relation.references[15] Arai S., Saito T., Endo M.:J. Electrochem. Soc., 2010, 157, D147. https://doi.org/10.1149/1.3280034
dc.relation.references[16] Arai S., Suwa Y., Endo M.:J. Electrochem. Soc., 2011, 158, D49. https://doi.org/10.1149/1.3518414
dc.relation.references[17] Ning D., Zhang A., Wu H.: Materials(Basel), 2019, 12, E392. https://doi.org/10.3390/ma12030392
dc.relation.references[18] An Z., Toda M., Ono T.: 2016 IEEE 29th Int. Conf. on Micro Electro Mechanical Systems (MEMS). 24-28 Jan. 2016, Shanghai, China. https://doi.org/10.1109/MEMSYS.2016.7421678
dc.relation.references[19] Guo H., Zhu H., Lin H., Zhang J.: Colloid Polym. Sci., 2008, 286, 587. https://doi.org/10.1007/s00396-007-1828-0
dc.relation.references[20] Zheng L., Sun J., Chen Q.: Micro Nano Lett., 2017,12, 722. https://doi.org/10.1049/mnl.2017.0317
dc.relation.references[21] Arai S., Endo M.: Electrochem. Commun., 2003, 5, 797. https://doi.org/10.1016/j.elecom.2003.08.002
dc.relation.references[22] Tihomirov V.: Peny. Teoriya i Praktika ih Polucheniya i Razrusheniya. Khimia, Moskva 1983.
dc.relation.referencesen[1] Pavlenko V., Yas D.:J. Powder Metall. Met. Ceram., 1976, 15, 89. https://doi.org/10.1007/BF00793555
dc.relation.referencesen[2] Uk P-H., Chung T-J., Lee H.:J. Ceram. Process. Res., 2017, 18, 440.
dc.relation.referencesen[3] Chu Y., Yu G., Hu B. et al., Adv. Powder Technol., 2014, 25, 477. https://doi.org/10.1016/j.apt.2013.07.003
dc.relation.referencesen[4] Chen L., Yu G., Chu Y. et al., Adv. Powder Technol., 2013, 24, 281. https://doi.org/10.1016/j.apt.2012.07.003
dc.relation.referencesen[5] Ajayan P., Schadler L., Braun P. (Eds.): Nanocomposite Science and Technology. Wiley-VCH Verlag GmbH, Weinheim 2003. https://doi.org/10.1002/3527602127
dc.relation.referencesen[6] Toth G., Maklin J., Halonen N. et al., Adv. Mater., 2009, 21, 2054. https://doi.org/10.1002/adma.200802200
dc.relation.referencesen[7] Berber S., Kwon Y., Tomanek D., Phys. Rev. Lett., 2000, 84, 4613. https://doi.org/10.1103/PhysRevLett.84.4613
dc.relation.referencesen[8]Jayathilaka W., Chinnappan A., Ramakrishna S.:J. Mater. Chem., 2017, P.5, 9209. https://doi.org/10.1039/P.7TC02965A
dc.relation.referencesen[9]Jiang L., Gao L., Sun J.:J. Colloid Interf. Sci., 2003, 260, 89. https://doi.org/10.1016/S0021-9797(02)00176-5
dc.relation.referencesen[10] Moore V., Strano M., Haroz E. et al., Nano Leters, 2003, 3, 1379. https://doi.org/10.1021/nl034524j
dc.relation.referencesen[11] Rastogi R., Kaushal R., Tripathi S. et al.:J. Colloid Interf. Sci., 2008, 328, 421. https://doi.org/10.1016/j.jcis.2008.09.015
dc.relation.referencesen[12] Strano M., Moore V., Miller M. et al.:J. Nanosci. Nanotechnol., 2003, 3, 81. https://doi.org/10.1166/jnn.2003.194
dc.relation.referencesen[13] Vaisman L., Wagner H., Marom G., Adv. Colloid Interf. Sci., 2006, 128-130, 37. https://doi.org/10.1016/j.cis.2006.11.007
dc.relation.referencesen[14] Schneider M., Weiser M., Dorfler S. et al., Surg. Eng., 2012, 28, 34. https://doi.org/10.1179/1743294411Y.0000000095
dc.relation.referencesen[15] Arai S., Saito T., Endo M.:J. Electrochem. Soc., 2010, 157, D147. https://doi.org/10.1149/1.3280034
dc.relation.referencesen[16] Arai S., Suwa Y., Endo M.:J. Electrochem. Soc., 2011, 158, D49. https://doi.org/10.1149/1.3518414
dc.relation.referencesen[17] Ning D., Zhang A., Wu H., Materials(Basel), 2019, 12, E392. https://doi.org/10.3390/ma12030392
dc.relation.referencesen[18] An Z., Toda M., Ono T., 2016 IEEE 29th Int. Conf. on Micro Electro Mechanical Systems (MEMS). 24-28 Jan. 2016, Shanghai, China. https://doi.org/10.1109/MEMSYS.2016.7421678
dc.relation.referencesen[19] Guo H., Zhu H., Lin H., Zhang J., Colloid Polym. Sci., 2008, 286, 587. https://doi.org/10.1007/s00396-007-1828-0
dc.relation.referencesen[20] Zheng L., Sun J., Chen Q., Micro Nano Lett., 2017,12, 722. https://doi.org/10.1049/mnl.2017.0317
dc.relation.referencesen[21] Arai S., Endo M., Electrochem. Commun., 2003, 5, 797. https://doi.org/10.1016/j.elecom.2003.08.002
dc.relation.referencesen[22] Tihomirov V., Peny. Teoriya i Praktika ih Polucheniya i Razrusheniya. Khimia, Moskva 1983.
dc.relation.urihttps://doi.org/10.1007/BF00793555
dc.relation.urihttps://doi.org/10.1016/j.apt.2013.07.003
dc.relation.urihttps://doi.org/10.1016/j.apt.2012.07.003
dc.relation.urihttps://doi.org/10.1002/3527602127
dc.relation.urihttps://doi.org/10.1002/adma.200802200
dc.relation.urihttps://doi.org/10.1103/PhysRevLett.84.4613
dc.relation.urihttps://doi.org/10.1039/C7TC02965A
dc.relation.urihttps://doi.org/10.1016/S0021-9797(02)00176-5
dc.relation.urihttps://doi.org/10.1021/nl034524j
dc.relation.urihttps://doi.org/10.1016/j.jcis.2008.09.015
dc.relation.urihttps://doi.org/10.1166/jnn.2003.194
dc.relation.urihttps://doi.org/10.1016/j.cis.2006.11.007
dc.relation.urihttps://doi.org/10.1179/1743294411Y.0000000095
dc.relation.urihttps://doi.org/10.1149/1.3280034
dc.relation.urihttps://doi.org/10.1149/1.3518414
dc.relation.urihttps://doi.org/10.3390/ma12030392
dc.relation.urihttps://doi.org/10.1109/MEMSYS.2016.7421678
dc.relation.urihttps://doi.org/10.1007/s00396-007-1828-0
dc.relation.urihttps://doi.org/10.1049/mnl.2017.0317
dc.relation.urihttps://doi.org/10.1016/j.elecom.2003.08.002
dc.rights.holder© Національний університет “Львівська політехніка”, 2021
dc.rights.holder© Roslyk I., Stovpchenko G., Galchenko G., 2021
dc.subjectповерхнево-активна речовина
dc.subjectвуглецеві нанотрубки (ВНТ)
dc.subjectмідний композиційний порошок
dc.subjectелектроосадження
dc.subjectультразвук
dc.subjectкорозійні властивості
dc.subjectsurfactants
dc.subjectcarbon nanotubes (CNTs)
dc.subjectcopper composite powder
dc.subjectelectrodeposition
dc.subjectultrasonic treatment
dc.subjectcorrosion resistance
dc.titleInfluence of Surfactants on Copper-CNTs Electrodeposition
dc.title.alternativeДослідження впливу поверхнево-активних речовин на одержання композиційних порошків мідь-ВНТ
dc.typeArticle

Files

Original bundle

Now showing 1 - 2 of 2
Thumbnail Image
Name:
2021v15n1_Roslyk_I-Influence_of_Surfactants_125-131.pdf
Size:
1.11 MB
Format:
Adobe Portable Document Format
Thumbnail Image
Name:
2021v15n1_Roslyk_I-Influence_of_Surfactants_125-131__COVER.png
Size:
565.54 KB
Format:
Portable Network Graphics

License bundle

Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
1.78 KB
Format:
Plain Text
Description: