The new developments in assembly technology for the sensors based on silicon structures
| dc.contributor.author | Szczepanski, Z. | |
| dc.date.accessioned | 2016-01-21T13:01:12Z | |
| dc.date.available | 2016-01-21T13:01:12Z | |
| dc.date.issued | 2004 | |
| dc.description.abstract | Sensor manufacturing process uses various technologies and various materials, but the sensors based on silicon structure became a dominant group of these devices. In the paper are given the last developments in assembly technique for silicon sensors. The results of our research concerning assembly technology for silicon humidity sensors and silicon gas sensors will be presented. Applied assembly processes are based on flip chip technology which plays the most important role in sensor packaging technology. | uk_UA |
| dc.identifier.citation | Szczepanski Z. The new developments in assembly technology for the sensors based on silicon structures / Z. Szczepanski // Вісник Національного університету «Львівська політехніка». – 2004. – № 510 : Елементи теорії та прилади твердотілої електроніки. – С. 39–44. – Bibliography: 8 titles. | uk_UA |
| dc.identifier.uri | https://ena.lpnu.ua/handle/ntb/31086 | |
| dc.language.iso | en | uk_UA |
| dc.publisher | Видавництво Національного університету "Львівська політехніка" | uk_UA |
| dc.title | The new developments in assembly technology for the sensors based on silicon structures | uk_UA |
| dc.type | Article | uk_UA |
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