Modification of silicon surface with silver, gold and palladium nanostructures via galvanic substitution in DMSO and DMF solutions

dc.citation.epage309
dc.citation.issue3
dc.citation.journalTitleChemistry & Chemical Technology
dc.citation.spage305
dc.citation.volume12
dc.contributor.affiliationLviv Polytechnic National University
dc.contributor.affiliationKarpenko Physico-Mechanical Institute, National Academy of Sciences of Ukraine
dc.contributor.authorKuntyi, Orest
dc.contributor.authorShepida, Mariana
dc.contributor.authorSus, Lubov
dc.contributor.authorZozulya, Galyna
dc.contributor.authorKorniy, Serhiy
dc.coverage.placenameLviv
dc.date.accessioned2019-06-20T11:19:52Z
dc.date.available2019-06-20T11:19:52Z
dc.date.created2018-01-20
dc.date.issued2018-01-20
dc.description.abstractНаведено результати досліджень процесу осадження нанорозмірних частинок срібла, паладію та золота на поверхню кремнію в середовищі DMSO та DMF. Описано вплив молекул органічних апротонних розчинників на геометрію металевих частинок та їх розподіл на підкладці. Показано, що розчини стійких комплексів металів ([Ag(CN)2]-, [AuCl4]-) є головним чинником формування дискретних наночастинок з невеликим діапазоном за розмірами та рівномірним розподілом по поверхні підкладки, а також наноструктурних плівок. Встановлено, що з підвищенням температури від 313 до 343 К спостерігається зміна структури осаду золота від плівкової до дисперсної, що зумовлено значним збільшенням швидкості електрогенеруючої реакції на мікроанодах кремнієвої поверхні та десорбцією молекул органічних розчинників із металевих зародків.
dc.description.abstractThe investigation results of silver, palladium and gold nanoscale particles deposition on the silicon surface in the DMSO and DMF media are presented. The influence of organic aprotic solvents on the geometry of metal particles and their distribution on the substrate is described. It is shown that solutions of stable metal complexes ([Ag (CN)2]–, [AuCl4]–) are the main factor in the formation of discrete nanoparticles with a small range of sizes and uniform distribution along the substrate surface, as well as nanostructured films. It has been established that the increase in temperature from 313 to 343 K changes the structure of the gold deposit from the film to the dispersed one, occurred due to a significant increase in the rate of the electrogenerating reaction on the silicon surface microanodes and desorption of organic solvents molecules from the metal nuclei.
dc.format.extent305-309
dc.format.pages5
dc.identifier.citationModification of silicon surface with silver, gold and palladium nanostructures via galvanic substitution in DMSO and DMF solutions / Orest Kuntyi, Mariana Shepida, Lubov Sus, Galyna Zozulya, Serhiy Korniy // Chemistry & Chemical Technology. — Lviv : Lviv Politechnic Publishing House, 2018. — Vol 12. — No 3. — P. 305–309.
dc.identifier.citationenModification of silicon surface with silver, gold and palladium nanostructures via galvanic substitution in DMSO and DMF solutions / Orest Kuntyi, Mariana Shepida, Lubov Sus, Galyna Zozulya, Serhiy Korniy // Chemistry & Chemical Technology. — Lviv : Lviv Politechnic Publishing House, 2018. — Vol 12. — No 3. — P. 305–309.
dc.identifier.urihttps://ena.lpnu.ua/handle/ntb/45187
dc.language.isoen
dc.publisherLviv Politechnic Publishing House
dc.relation.ispartofChemistry & Chemical Technology, 3 (12), 2018
dc.relation.references[1] Ego T., Hagihara T.,Moriia Y. et al.: ECS Trans., 2013, 50, 143.https://doi.org/10.1149/05052.0143ecst
dc.relation.references[2] Kim T., Braun G., She Z. et al.: ACS Appl. Mater. Interfaces.,2016, 8, 30449. https://doi.org/10.1021/acsami.6b09518
dc.relation.references[3] Ensafi A., Rezaloo F., Rezaei B.: Sensor. Actuat. B-Chem.,2016, 231, 239. https://doi.org/10.1016/j.snb.2016.03.018
dc.relation.references[4] Lahiri A., Wen R., Kuimalee S. et al.: Lett. J. Appl. Phys., 2013,46, 275303. https://doi.org/10.1088/0022-3727/46/27/275303
dc.relation.references[5] Itasaka H., Nishi M., Shimizu M., Hirao K.: J. Electrochem. Society, 2016, 163, D743. https://doi.org/10.1149/2.0261614jes
dc.relation.references[6] Sayed S., Wang F., Malac M. et al.: ASC Nano, 2009, 3, 2809.https://doi.org/10.1021/nn900685a
dc.relation.references[7] Yamada N., Atsushiba H., Sakamoto S. et al.: ECS Trans., 2015,69, 59. https://doi.org/10.1149/06939.0059ecst
dc.relation.references[8] Raygani A., Magagnin L.: ECS Transactions, 2012, 41, 3-8.https://doi.org/10.1149/1.3699373
dc.relation.references[9] Gutes A., Carraro C., Maboudian R.: ACS Appl. Mater. Interfaces, 2011, 3, 1581. https://doi.org/10.1021/am200144k
dc.relation.references[10] Yae S., Enomoto M., Atsushiba H. et al.: ECS Transactions,2013, 53, 99. https://doi.org/10.1149/05306.0099ecst
dc.relation.references[11] Gorostiza P., Servat J., Morante J., Sanz F.: Thin Solid Films,1996, 275, 12. https://doi.org/10.1016/0040-6090(95)07009-5
dc.relation.references[12] Yae S., Kawamoto Y., Tanaka H. et al.: Electrochem. Comm.,2003, 5, 632. https://doi.org/10.1016/S1388-2481(03)00146-2
dc.relation.references[13] Yae S., Kobayashi T., Kawagishi T. et al.: Solar Energy, 2006,80, 701. https://doi.org/10.1016/j.solener.2005.10.011
dc.relation.references[14] Wei Q., Shi Y., Sun K-Q., Xu B-Q.: Chem. Comm., 2016, 52,3026. https://doi.org/10.1039/C5CC07474F
dc.relation.references[15] Yae S., Morii Y., Fukumuro N., Matsuda H.: Nanoscale Res. Lett., 2012, 7, 352. https://doi.org/10.1186/1556-276X-7-352
dc.relation.references[16] Sadakane D., Yamakawa K., Fukumuro N., Yae S.: ECS Transactions, 2015, 69, 179. https://doi.org/10.1149/06902.0179ecst
dc.relation.references[17] daRosa C., Maboudian R., Iglesia E.: J. Electrochem. Society,2008, 155, E70. https://doi.org/10.1149/1.2907155
dc.relation.references[18] Scudiero L., Fasasi A., Griffiths P.: Applied Surface Science,2011, 257, 4422. https://doi.org/10.1016/j.apsusc.2010.12.078
dc.relation.references[19] Papaderakis A., Mintsouli I., Georgieva J., Sotiropoulos S.: Catalysts, 2017, 7, 80. https://doi.org/10.3390/catal7030080
dc.relation.references[20] Polavarapu L., Liz-Marz´an L.: Nanoscale, 2013, 5, 4355.https://doi.org/10.1039/c3nr01244a
dc.relation.references[21] Kuntyi O.:Mater. Sci., 2006, 42, 681.
dc.relation.references[22] Dobrovets’ka O., Kuntyi O., Zozulya G. et al.: Mater. Sci.,2015, 51, 418.
dc.relation.references[23] Kuntyi O., Stakhira P. Cherpak V. et al.: Micro Nano Lett.,2011, 6, 592.
dc.relation.references[24] Zhike Wang, Donghui Chen, Liang Chen.: Hydrometallurgy,2007, 89, 196. https://doi.org/10.1016/j.hydromet.2007.07.005
dc.relation.references[25] Kuntyi O.: Electrokhimia taMorphologia DispersnykhMetaliv. Vyd-vo LP, Lviv 2008.
dc.relation.referencesen[1] Ego T., Hagihara T.,Moriia Y. et al., ECS Trans., 2013, 50, 143.https://doi.org/10.1149/05052.0143ecst
dc.relation.referencesen[2] Kim T., Braun G., She Z. et al., ACS Appl. Mater. Interfaces.,2016, 8, 30449. https://doi.org/10.1021/acsami.6b09518
dc.relation.referencesen[3] Ensafi A., Rezaloo F., Rezaei B., Sensor. Actuat. B-Chem.,2016, 231, 239. https://doi.org/10.1016/j.snb.2016.03.018
dc.relation.referencesen[4] Lahiri A., Wen R., Kuimalee S. et al., Lett. J. Appl. Phys., 2013,46, 275303. https://doi.org/10.1088/0022-3727/46/27/275303
dc.relation.referencesen[5] Itasaka H., Nishi M., Shimizu M., Hirao K., J. Electrochem. Society, 2016, 163, D743. https://doi.org/10.1149/2.0261614jes
dc.relation.referencesen[6] Sayed S., Wang F., Malac M. et al., ASC Nano, 2009, 3, 2809.https://doi.org/10.1021/nn900685a
dc.relation.referencesen[7] Yamada N., Atsushiba H., Sakamoto S. et al., ECS Trans., 2015,69, 59. https://doi.org/10.1149/06939.0059ecst
dc.relation.referencesen[8] Raygani A., Magagnin L., ECS Transactions, 2012, 41, 3-8.https://doi.org/10.1149/1.3699373
dc.relation.referencesen[9] Gutes A., Carraro C., Maboudian R., ACS Appl. Mater. Interfaces, 2011, 3, 1581. https://doi.org/10.1021/am200144k
dc.relation.referencesen[10] Yae S., Enomoto M., Atsushiba H. et al., ECS Transactions,2013, 53, 99. https://doi.org/10.1149/05306.0099ecst
dc.relation.referencesen[11] Gorostiza P., Servat J., Morante J., Sanz F., Thin Solid Films,1996, 275, 12. https://doi.org/10.1016/0040-6090(95)07009-5
dc.relation.referencesen[12] Yae S., Kawamoto Y., Tanaka H. et al., Electrochem. Comm.,2003, 5, 632. https://doi.org/10.1016/S1388-2481(03)00146-2
dc.relation.referencesen[13] Yae S., Kobayashi T., Kawagishi T. et al., Solar Energy, 2006,80, 701. https://doi.org/10.1016/j.solener.2005.10.011
dc.relation.referencesen[14] Wei Q., Shi Y., Sun K-Q., Xu B-Q., Chem. Comm., 2016, 52,3026. https://doi.org/10.1039/P.5CC07474F
dc.relation.referencesen[15] Yae S., Morii Y., Fukumuro N., Matsuda H., Nanoscale Res. Lett., 2012, 7, 352. https://doi.org/10.1186/1556-276X-7-352
dc.relation.referencesen[16] Sadakane D., Yamakawa K., Fukumuro N., Yae S., ECS Transactions, 2015, 69, 179. https://doi.org/10.1149/06902.0179ecst
dc.relation.referencesen[17] daRosa C., Maboudian R., Iglesia E., J. Electrochem. Society,2008, 155, E70. https://doi.org/10.1149/1.2907155
dc.relation.referencesen[18] Scudiero L., Fasasi A., Griffiths P., Applied Surface Science,2011, 257, 4422. https://doi.org/10.1016/j.apsusc.2010.12.078
dc.relation.referencesen[19] Papaderakis A., Mintsouli I., Georgieva J., Sotiropoulos S., Catalysts, 2017, 7, 80. https://doi.org/10.3390/catal7030080
dc.relation.referencesen[20] Polavarapu L., Liz-Marz´an L., Nanoscale, 2013, 5, 4355.https://doi.org/10.1039/P.3nr01244a
dc.relation.referencesen[21] Kuntyi O.:Mater. Sci., 2006, 42, 681.
dc.relation.referencesen[22] Dobrovets’ka O., Kuntyi O., Zozulya G. et al., Mater. Sci.,2015, 51, 418.
dc.relation.referencesen[23] Kuntyi O., Stakhira P. Cherpak V. et al., Micro Nano Lett.,2011, 6, 592.
dc.relation.referencesen[24] Zhike Wang, Donghui Chen, Liang Chen., Hydrometallurgy,2007, 89, 196. https://doi.org/10.1016/j.hydromet.2007.07.005
dc.relation.referencesen[25] Kuntyi O., Electrokhimia taMorphologia DispersnykhMetaliv. Vyd-vo LP, Lviv 2008.
dc.relation.urihttps://doi.org/10.1149/05052.0143ecst
dc.relation.urihttps://doi.org/10.1021/acsami.6b09518
dc.relation.urihttps://doi.org/10.1016/j.snb.2016.03.018
dc.relation.urihttps://doi.org/10.1088/0022-3727/46/27/275303
dc.relation.urihttps://doi.org/10.1149/2.0261614jes
dc.relation.urihttps://doi.org/10.1021/nn900685a
dc.relation.urihttps://doi.org/10.1149/06939.0059ecst
dc.relation.urihttps://doi.org/10.1149/1.3699373
dc.relation.urihttps://doi.org/10.1021/am200144k
dc.relation.urihttps://doi.org/10.1149/05306.0099ecst
dc.relation.urihttps://doi.org/10.1016/0040-6090(95)07009-5
dc.relation.urihttps://doi.org/10.1016/S1388-2481(03)00146-2
dc.relation.urihttps://doi.org/10.1016/j.solener.2005.10.011
dc.relation.urihttps://doi.org/10.1039/C5CC07474F
dc.relation.urihttps://doi.org/10.1186/1556-276X-7-352
dc.relation.urihttps://doi.org/10.1149/06902.0179ecst
dc.relation.urihttps://doi.org/10.1149/1.2907155
dc.relation.urihttps://doi.org/10.1016/j.apsusc.2010.12.078
dc.relation.urihttps://doi.org/10.3390/catal7030080
dc.relation.urihttps://doi.org/10.1039/c3nr01244a
dc.relation.urihttps://doi.org/10.1016/j.hydromet.2007.07.005
dc.rights.holder© Національний університет „Львівська політехніка“, 2018
dc.rights.holder©Kuntyi O., Shepida M., Sus L., Zozulya G., Korniy S., 2018
dc.subjectґальванічне заміщення
dc.subjectсрібло
dc.subjectпаладій
dc.subjectзолото
dc.subjectкремній
dc.subjectDMF
dc.subjectDMSO
dc.subjectgalvanic substitution
dc.subjectsilver
dc.subjectpalladium
dc.subjectgold
dc.subjectsilicon
dc.subjectDMF
dc.subjectDMSO
dc.titleModification of silicon surface with silver, gold and palladium nanostructures via galvanic substitution in DMSO and DMF solutions
dc.title.alternativeМодифікація поверхні кремнію нано-структурами срібла золота і паладію ґальванічним заміщенням у DMSO і DMF
dc.typeArticle

Files

Original bundle

Now showing 1 - 2 of 2
Thumbnail Image
Name:
2018v12n3_Kuntyi_O-Modification_of_silicon_305-309.pdf
Size:
417.75 KB
Format:
Adobe Portable Document Format
Thumbnail Image
Name:
2018v12n3_Kuntyi_O-Modification_of_silicon_305-309__COVER.png
Size:
521.14 KB
Format:
Portable Network Graphics

License bundle

Now showing 1 - 1 of 1
No Thumbnail Available
Name:
license.txt
Size:
3 KB
Format:
Plain Text
Description: