Analysis of ceramic chip capacitors at high frequency

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dc.citation.journalTitleЕлементи теорії та прилади твердотілої електроніки
dc.contributor.affiliationUniversity Politehnica Bucharest, Romaniauk_UA
dc.contributor.authorGolumbeanu, Virgil
dc.contributor.authorSvasta, Paul
dc.contributor.authorIonescu, Ciprian
dc.coverage.countryUAuk_UA
dc.coverage.placenameЛьвівuk_UA
dc.date.accessioned2018-08-15T12:05:49Z
dc.date.available2018-08-15T12:05:49Z
dc.date.issued2002
dc.description.abstractThe dimensions of monolithic ceramic capacitors today becomes very small and they presents good performance at high frequency. It is used in various high frequency circuits for impedance matching, DC block, filter, bypass and decoupling functions. For the best performance in these applications , low equivalent series resistance and equivalent series inductance is required. This parameters are analyzed in the paper for multilayer ceramic chip capacitors. Using an impedance analyzer and SPICE simulations the impedance of capacitors at high frequency is presented.uk_UA
dc.format.pages25–31
dc.identifier.citationGolumbeanu V. Analysis of ceramic chip capacitors at high frequency / V. Golumbeanu, P. Svasta, C. Ionescu // Вісник Національного університету "Львівська політехніка". – 2002. – № 458 : Елементи теорії та прилади твердотілої електроніки. – С. 25–31. – Bibliography: 9 titles.uk_UA
dc.identifier.urihttps://ena.lpnu.ua/handle/ntb/42484
dc.language.isoenuk_UA
dc.publisherВидавництво Національного університету "Львівська політехніка"uk_UA
dc.relation.references[1] M. Montrose, "Printed Circuit Board Design Techniques for EMC Compliance", IEEE Press, New York, 1996. [2] M. Montrose, "EMC and the Printed Circuit Board. Design, Theory, and Layout Made Simple", IEEE Press, New York, 1999. [3] Y. Sakabe, M. Hayashi, T. Ozaki, J. Canner, “High Frequency Measurement of Multilayer Ceramic Capacitors”, IEEE trans. on CPMTEMC, vol. 19, no.1, 1996, pp 7 - 14. [4] P. Claiton, "Effectiveness of Multiple Decoupling Capacitors", IEEE Trans on EMC, vol.34, nr.2, 1992, pp. 130-133. [5] L. Smith, R. Anderson, D. Forehand, T. Pelc, T. Roy, "Power Distribution System Design Methodology and Capacitor Selection for Modern CMOS Technology", IEEE Trans. on Advanced Packaging, vol. 22, nr3, 1999, pp. 284-291. [6] Vishay, “Monolithic Ceramic Chip Capacitor”, www:vishay.com. [7] AVX, “Chip Capacitors”, www:avx.com. [8] C. Val, L. Bui, M. Petit, “High Density Surface Mounting Power Supply”, ISHM Proc., Baltimore, 1989, pp. 670-677. [9] P. Svasta, V.Golumbeanu, et all, "Training Program in Electronic Passive Components Education", Proc. ECTC, San Diego, 2002, pp. 780-786.uk_UA
dc.rights.holder© Virgil Golumbeanu, Paul Svasta, Ciprian Ionescu, 2002uk_UA
dc.subjectceramic capacitorsuk_UA
dc.subjectequivalent series resistanceuk_UA
dc.subjectequivalent series inductanceuk_UA
dc.subjectequivalent circuitsuk_UA
dc.subjectimpedanceuk_UA
dc.titleAnalysis of ceramic chip capacitors at high frequencyuk_UA
dc.typeArticleuk_UA

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Елементи теорії та прилади твердотілої електроніки. – 2002. – №458