Reliability improvement in consequence of investigation PCB silver electrochemical migrations

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dc.citation.journalTitleЕлементи теорії та прилади твердотілої електроніки
dc.contributor.affiliationTechnical University of Sofia, Dept. of Microelectronicsuk_UA
dc.contributor.authorJordanov, Nikola Stefanov
dc.contributor.authorAndonova, Anna Stoynova
dc.contributor.authorAtanasova, Natasha Georgieva
dc.coverage.countryUAuk_UA
dc.coverage.placenameЛьвівuk_UA
dc.date.accessioned2018-08-28T14:47:10Z
dc.date.available2018-08-28T14:47:10Z
dc.date.issued2002
dc.description.abstractLooking for a compromise between high functionality and convenient and effective materials the silver has got many proved and achievements qualities for PCB. The main problem in using as a constructive materials its high disposition of migration. The investigation of a concrete type of migration between silver conductors is the goal of the paper. For this purpose an investigation techniques is presented to qualifying PCB structures. Some test structures are designed and produced and experimental results are results are analyzed.uk_UA
dc.format.pages138–144
dc.identifier.citationJordanov N. S. Reliability improvement in consequence of investigation PCB silver electrochemical migrations / Nikola Stefanov Jordanov, Anna Stoynova Andonova, Natasha Georgieva Atanasova // Вісник Національного університету "Львівська політехніка". – 2002. – № 458 : Елементи теорії та прилади твердотілої електроніки. – С. 138–144. – Bibliography: 4 titles.uk_UA
dc.identifier.urihttps://ena.lpnu.ua/handle/ntb/42542
dc.language.isoenuk_UA
dc.publisherВидавництво Національного університету "Львівська політехніка"uk_UA
dc.relation.references[1] Nikola Jordanov, Natasha Atanasova, Anna Andonova, Dimiter Dimitrov, “Processing Induced Material Interactions Determining the Reliability of PCB”, Proceedings of the Int. Conference Electonics’02”, 2002, Sozopol, Bulgaria (to be printed). [2] G. Harsányia,” Material design aspects of high reliability, high density interconnections”, Microelectronics Reliability, 2001, Vol. 41, No. 2, pp.229-237. [3] P. Bojta, P. Németh and G. Harsányi, “Searching for appropriate humidity accelerated migration reliability tests”, Microelectronics and Reliability.1996, Vol. 36, No.4, pp. 534. [4] David E. Mortin, Jane G. Krolewski, Michael J. Cushing,” Consideration of component failure mechanisms in the reliability assessment of electronic equipment-addressing the constant failure rate assumption”, Microelectronics and Reliability, 1996,Vol.36, No. 4, pp. 534-535.uk_UA
dc.rights.holder© Nikola Stefanov Jordanov, Anna Stoynova Andonova, Natasha Georgieva Atanasova, 2002uk_UA
dc.subjectSilver electrochemicalmigrationuk_UA
dc.subjectElectrochemistyuk_UA
dc.subjectConductive filmsuk_UA
dc.subjectReliabilityuk_UA
dc.subjectFailure analysisuk_UA
dc.subjectMultichip modulesuk_UA
dc.titleReliability improvement in consequence of investigation PCB silver electrochemical migrationsuk_UA
dc.typeArticleuk_UA

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Елементи теорії та прилади твердотілої електроніки. – 2002. – №458