Survey of quality and reliability problems in design of MEMS

Simple item page
dc.citation.journalTitleЕлементи теорії та прилади твердотілої електроніки
dc.contributor.affiliationTechnical University – Sofia, Bulgariauk_UA
dc.contributor.authorAndonova, Anna Stoynova
dc.contributor.authorAtanasova, Natasha Georgieva
dc.coverage.countryUAuk_UA
dc.coverage.placenameЛьвівuk_UA
dc.date.accessioned2018-08-15T12:22:58Z
dc.date.available2018-08-15T12:22:58Z
dc.date.issued2002
dc.description.abstractThe interdisciplinary nature of MicroElectroMechanical Systems (MEMS) utilizes design engineering and manufacturing expertise from a wide and diverse range of technical areas. In order to produce a high reliability and quality MEMS we must not only examine the device itself, but must also examine the entire process surrounding the devices, from conception to finish. This means that the process must be qualified, with the supplier fully investigated, the design verified, and the packaging certified. The paper presents a survey of the various aspects of MEMS, with emphasis on its reliability and quality features in the design phase.uk_UA
dc.format.pages38–43
dc.identifier.citationAndonova A. S. Survey of quality and reliability problems in design of MEMS / A. S. Andonova, N. G. Atanasova // Вісник Національного університету "Львівська політехніка". – 2002. – № 458 : Елементи теорії та прилади твердотілої електроніки. – С. 38–43. – Bibliography: 4 titles.uk_UA
dc.identifier.urihttps://ena.lpnu.ua/handle/ntb/42487
dc.language.isoenuk_UA
dc.publisherВидавництво Національного університету "Львівська політехніка"uk_UA
dc.relation.references[1] G. Kovacs, Micromachined Transducers Sourcebook, McGraw-Hill, New York, NY, 1998. [2] S. Sze, Semiconductor Sensors, Wiley Inter-Science, New York, 1994 [3] D. M. Tanner at all, “Reliability Test of a Surface Micromachined Microengine Using SHiMMeR” Proceedings of SPIE, Vol. 3224, PP 14-23, 1997. [4] W. Kalita, J. Potenski, “Activity of the Rzeszow Centre in the Field of Microelectronics and Packaging-Investigations and Production”, Proceedings of IMAPS, Poland 2001, pp.13-20.uk_UA
dc.rights.holder© Anna Stoynova Andonova, Natasha Georgieva Atanasova, 2002uk_UA
dc.subjectMEMSuk_UA
dc.subjectQualityuk_UA
dc.subjectReliabilityuk_UA
dc.subjectFailure Modesuk_UA
dc.subjectFault Simulationuk_UA
dc.titleSurvey of quality and reliability problems in design of MEMSuk_UA
dc.typeArticleuk_UA

Files

Original bundle

Now showing 1 - 1 of 1
Thumbnail Image
Name:
8_38-43.pdf
Size:
86 KB
Format:
Adobe Portable Document Format
Description:
Download

Collections

Елементи теорії та прилади твердотілої електроніки. – 2002. – №458